Alumina Nitride

Manufacturers looking for ceramics with high heat dissipation and thermal conductivity choose our aluminum nitride substrate. Our proprietary thick-film screening process is designed to print copper on our aluminum nitride substrate making our product an ideal substrate for compact, high-density hybrids.

Our aluminum nitride has a thermal coefficient of expansion as low as 3.5x10(-6) making it a perfect match with a silicon wafer. The thermal conductivity of our substrate exceeds 200W/mK delivering 10x more head conductivity then alumina. Compared to BeO(Beryllium Oxide) this material is non toxic and environmentally friendly.

Thin & Thick Film Use

As Fired - fully dense substrates with an as-fired finish of 4 micro-inches or better.

Lapped - precisly flat and parallel substrate within 1 micro-meter.

Polished - we supply AlN for demanding thin-film applications which require the best optical finish as fine as 20 Angstroms.

AlN - Alumina Nitride RFQ

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